Samsung have already started production of 128GB DDR4 Modules, expect to start shipments soon. Early pricing is very high at £2800 per module which is to expected. The moduels feature Samsung’s new TSV RDIMM technology which paves the way for ultra-high capacity memory at an enterprise level. The new TSV DRAM module is touted as the largest capacity and the highest energy efficiency of any DRAM modules currently available, all the while performing at high speeds and with a focus on reliability. The 128GB TSV DDR4 RDIMM is equipped with 144 DDR4 chips arranged into 36 4GB DRAM packages, each of which contain four 20-nm-based 8Gb chips assembled with advanced TSV packaging technology.

                                                          Samsung 128GB DDR4

While traditional chip packages interconnect die stacks via wire bonding, TSV packages use chip dies that are ground down to just micrometers then pierced with hundreds of fine holes and vertically connected by electrodes passing through the holes. This enables a substantial increase in signal transmission. Additionally, Samsung’s new 128GB TSV DDR4 module is comprised of a unique design where the master chip of each 4GB package embeds the data buffer function to optimize module performance and power efficiency.

As a result servers can reach 2,400 megabits per second (Mbps), roughly twice their normal speed at half the power usage. Samsung says it’s now accelerating production of TSV technology to ramp up 20nm 8GB DRAM chips to improve manufacturing productivity.
“We will continue to expand our technical cooperation with global leaders in servers, consumer electronics and emerging markets,” said Joo Sun Choi, executive vice president of Memory Sales and Marketing at Samsung Electronics.

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